PART |
Description |
Maker |
G65SC22PEI3 G65SC22PEI1 G65SC22PEI2 G65SC22PEI4 G6 |
CMOS VERSATILE INTERFACE ADAPTER WITH INTERVAL TIMER/COUNTERS Tantalum Molded Capacitor; Capacitance: 150uF; Voltage: 10V; Case Size: 7.3x4.3 mm; Packaging: Tape & Reel 的CMOS多功能接口适配器间隔计时器/计数 Tantalum Molded Capacitor; Capacitance: 22uF; Voltage: 10V; Packaging: Tape & Reel Tantalum Molded Capacitor; Capacitance: 2.2uF; Voltage: 10V; Case Size: 3.2x1.6 mm; Packaging: Tape & Reel Tantalum Molded Capacitor; Capacitance: 150uF; Voltage: 10V; Case Size: 7.3x4.3 mm; Packaging: Tape & Reel Peripheral Interface
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California Micro Devices Co... California Micro Devices Corporation
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AM29818AXM AM29818ADE AM29818APC AM29818ADCB AM298 |
Digital Audio Driver with Discrete Dead-Time and Protection. High and Low Side Driver in a 14-Lead SOIC package; A IRS20124S packaged in a Lead-Free Pipeline Register High Performance Appliance RAM Based Motion Control IC; A IRMCF343 with Standard Packaging High Voltage, high performance Class D audio aplifier driver with PWM modulator and protection in a 16-Lead PDIP Package; A IRS2092PBF with Standard Packaging Fully optimized solution for high current synchronous buck multiphase applications in a LGA power block.; Similar to IP2003ATR with Lead Free Packaging. High Voltage, high performance Class D audio aplifier driver with PWM modulator and protection in a 16-Lead SOIC Narrow Package; Similar to IRS2092PBF Shipped on Tape and Reel Synchronous Buck Multiphase Optimized BGA Power Block.; Similar to iP2002 with Lead Free Packaging on Tape and Reel. 500VA HiRel iMotion Digital Sensor-Less Motor Controller in an MP-3T package.; A IRMCT3UF1 with Standard Packaging Fully optimized solution for high current synchronous buck multiphase applications in a LGA power block.; Similar to IP2003A with Lead Free Packaging. A high performance OTP based motion control IC designed primarily for appliance applications.; A IRMCK343 with Standard Packaging Self-Oscillating Full-Bridge 600V Driver in a 14-Lead SOIC narrow boddy package; A IRS2453D packaged in a Lead-Free 14-Lead SOIC shipped on Tape and Reel Protected Digital Audio Driver with Floating PWM input in a 16-Lead SOIC Narrow Package; A IRS20955SPBF packaged in a Lead-Free 16-Lead SOIC Narrow shipped on Tape and Reel IP1001; A IP1001 with Standard Packaging Dual Output Full Function 2 Phase Synchronous Power Block, Integrated Power Semiconductors, PWM Controller and Passives.; Similar to iP1201 with Lead Free packaging. Protected Digital Audio Driver with Floating PWM input; A IRS20954SPBF with Standard Packaging 管道注册
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Advanced Micro Devices, Inc.
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G751-2P8 G751 G751-1P1 G751-2P1 |
Tantalum Conformal-Coated Capacitor; Capacitance: 33uF; Voltage: 6.3V; Case Size: 1.6x3.2 mm; Packaging: Tape & Reel Tantalum Conformal-Coated Capacitor; Capacitance: 33uF; Voltage: 6.3V; Packaging: Tape & Reel Tantalum Conformal-Coated Capacitor; Capacitance: 33uF; Voltage: 6.3V; Case Size: 1.6x3.2 mm; Packaging: Tape & Reel Tantalum Conformal-Coated Capacitor; Capacitance: 33uF; Voltage: 6.3V; Packaging: Tape & Reel Digital Temperature Sensor and Thermal Watchdog with Two-Wire Interface
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Global Mixed-mode Technology Inc. GMT[Global Mixed-mode Technology Inc]
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G690L438T21 G691L293T92 G690L400T71 G690H463T96 G6 |
Tantalum Molded Capacitor; Capacitance: 33uF; Voltage: 16V; Case Size: 5.8x3.1 mm; Packaging: Tape & Reel 122 x 32 pixel format, LED or EL Backlight available 微处理器复位IC Tantalum Molded Capacitor; Capacitance: 4.7uF; Voltage: 16V; Case Size: 3.4x1.9 mm; Packaging: Tape & Reel 微处理器复位IC Microprocessor Reset IC 微处理器复位IC CAB 6C 3#16 3#0 SKT PLUG Tantalum Molded Capacitor; Capacitance: 33uF; Voltage: 16V; Case Size: 5.8x3.1 mm; Packaging: Tape & Reel
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Global Mixed-mode Technology, Inc. ETC Global Mixed-mode Technology Inc.
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KBJ10J KBJ10A KBJ10B KBJ10M KBJ10D |
Tantalum Molded Capacitor; Capacitance: 68uF; Voltage: 16V; Case Size: 7.3x4.3 mm; Packaging: Tape & Reel Tantalum Molded Capacitor; Capacitance: 47uF; Voltage: 16V; Case Size: 7.3x4.3 mm; Packaging: Tape & Reel TECHNICAL SPECIFICATIONS OF SINGLE-PHASE SILCON BRIDGE RECTIFIER 技术规格单相桥式整流器秀
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DC Components Co., Ltd.
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G681 G680 |
Microprocessor Reset IC Tantalum Molded Capacitor; Capacitance: 100uF; Voltage: 16V; Case Size: 4.3x7.3 mm; Packaging: Tape & Reel Tantalum Molded Capacitor; Capacitance: 1.5uF; Voltage: 16V; Case Size: 3.2x1.6 mm; Packaging: Tape & Reel
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List of Unclassifed Manufacturers ETC[ETC] Electronic Theatre Controls, Inc.
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0878580460 87858-0460 |
2.00mm (.079) Pitch Milli-Grid?/a> Breakaway Header, Surface Mount, Single Row, Vertical, without Peg, with Kapton Tape, Tape on Reel Packaging 2.00mm (.079) Pitch Milli-Grid Breakaway Header, Surface Mount, Single Row, Vertical, without Peg, with Kapton Tape, Tape on Reel Packaging
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Molex Electronics Ltd.
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CT10-1532-G2 |
Tape and reel packaging
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Coto Technology
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WAN-0165 |
Safe Handling and Packaging of Tape and Reel Product to be Returned
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Wolfson Microelectronics plc
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6861XX14122 |
1.0MM ZIF FPC HORIZONTAL TOP CONTACT TYPE - TAPE & REEL PACKAGING
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Wurth Elektronik GmbH & Co. KG, Germany.
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AM29F200B-75FC AM29F200B-75SC AM29F200B-75EC AM29F |
20V Single N-Channel HEXFET Power MOSFET in a I-Pak package; A IRLU3714Z with Standard Packaging 80V Single N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7493 with Standard Packaging x8/x16 Flash EEPROM 40V Single N-Channel HEXFET Power MOSFET in a D2Pak package; A IRL1404ZS with Standard Packaging 30V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRL3803S with Lead Free Packaging 55V Single N-Channel HEXFET Power MOSFET in a TO-262 package; Similar to IRF1405ZL with Lead Free Packaging 100V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRL540N with Standard Packaging 55V Single N-Channel HEXFET Power MOSFET in a D-Pak package; Similar to IRFR024N with Lead Free Packaging 75V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU2407 with Lead Free Packaging 100V Single N-Channel HEXFET Power MOSFET in a D-Pak package; A IRFR3410 with Standard Packaging 75V Single N-Channel HEXFET Power MOSFET in a I-Pak package; A IRFU2407 with Standard Packaging 150V Single N-Channel Digital Audio HEXFET Power MOSFET in a TO-220AB package; A IRFB4019PBF with Standard Packaging 20V Single N-Channel HEXFET Power MOSFET in a TO-262 package; A IRF1302L with Standard Packaging 55V Single N-Channel HEXFET Power MOSFET in a D-Pak package; A IRFR2405 with Standard Packaging 200V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; A IRF630NS with Tape and Reel Right Packaging 30V Single N-Channel HEXFET Power MOSFET in a D-Pak package; A IRLR7843 with Standard Packaging 80V Single N-Channel HEXFET Power MOSFET in a I-Pak package; A IRFU3418 with Standard Packaging 100V Single N-Channel HEXFET Power MOSFET in a TO-262 package; A IRF540ZL with Standard Packaging 100V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRF540N with Standard Packaging A 20V Single N-Channel HEXFET Power MOSFET in a DirectFET MP, 59 Amps 55V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRLU3705Z with Lead Free Packaging 30V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRLU3303 with Lead Free Packaging 55V Single N-Channel HEXFET Power MOSFET in a I-Pak package; A IRLU024Z with Standard Packaging 20V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; A IRF3704ZCS with Standard Packaging 200V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRF630NS with Lead Free Packaging 55V Single N-Channel HEXFET Power MOSFET in a TO-262 package; Similar to IRFZ46ZL with Lead Free Packaging 60V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRFZ34VS with Lead Free Packaging 30V Single N-Channel HEXFET Power MOSFET in a TO-262 package; A IRL7833L with Standard Packaging 30V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRL3103 with Standard Packaging 12V Single N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7476 with Lead Free Packaging x8/x16闪存EEPROM 100V Single N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7495 with Standard Packaging x8/x16闪存EEPROM
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Advanced Micro Devices, Inc. Aeroflex, Inc.
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87891-2818 0878912818 |
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 28 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free 2.54mm (.100) Pitch KK垄莽 Header, Through Hole, Breakaway, Vertical, 28 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
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Molex Electronics Ltd.
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